|Título/s:||Packaging on LTCC: Microrelay and RFID|
|Autor/es:||Malatto, L.; Lozano, A.; Fraigi, L.; Lupi, D.|
|Institución:||INTI-Electrónica e Informática. Buenos Aires, AR|
|Palabras clave:||Dispositivos electrónicos; Microelectrónica; Envasamiento; Relés; Materiales cerámicos; Actuadores; Antenas; Radiofrecuencia|
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PACKAGING ON LTCC: MICRORELAY AND RFID
L. Malatto, A. Lozano, L. Fraigi, D Lupi
Centro de Investigación y Desarrollo en Telecomunicaciones, Electrónica e Informática – CITEI
Instituto Nacional de Tecnología Industrial – INTI
Av. Gral Paz 5445, (B1650 KNA) San Martín, Pcia. Buenos Aires, Argentina
Summary: We present the first results of MEMS packaging integrated with LTCC (Low Temperature Co-fired
Ceramics) technology. Two cases were implemented: a packaging of a MEMS microrelay with lateral contact
structures driven by electrostatic actuators, and an integrated antenna for commercial RFID (Radio Frequency
Identification), which is under development.
Keywords: MEMS packaging, LTCC, microrelay, RFID
Low Temperature Co-fired Ceramic (LTCC) is well
known as an appropriate material for multilayer
packaging. This material joined to thick film technology
results in an interesting field for MEMS applications.
LTCC tape materials for 3D structures using multi-
layer have many benefits for packaging silicon based
MEMS components. Cavities structures, in which the
MEMS can be bonded and hermetically sealed, and a
good match of thermal coefficient of expansion (TCE)
between ceramic and Si are some advantages of LTCC
In this work we present LTCC packaging for two
different applications, a MEMS microrelay developed on
epitaxied SOI  and antennas for commercial Radio
Frequency Identification (RFID).
Two models of packaging for the SOI microrelay
prototypes were performed: a top contact design with all
electrical connections at one side of the packaging, and a
bottom contact design using through holes. Twelve layers
were necessary to achieve a properly package.
DuPont LTCC Green Tape 951 AT and DuPont 6148
silver thick film paste were used, with screen printing
technique. Cavities and through holes were done and
separately lamination steps were performed in order to
obtain an appropriate structure. Lamination pressure was
of 1 kg.mm-2 at a temperature of 100°C, applied during 3
minutes for each lamination procedure. Typical firing
profile for LTCC was applied and a shrinkage value of
14% in x-y direction was obtained.
MEMS microrelay dies were attached to LTCC
package with Dow Corning 7920 material. Fig.1 shows
first prototypes of MEMS packages obtained with LTCC
multilayer ceramic technology.
Two models of LTCC integrated antennas for
commercial RFID were designed. EM-Microelectronic
devices for low (125 kHz) and high (13.56 MHz)
frequencies were used. First antenna, named multi loop
(ML), is a 2D-structure flat square spiral coil. The other
design, named uni loop (UL), is a multi layer square loop
in a 3D-structure. Fig. 2 shows a ML antenna, at left, and
a UL with 2nd level packaging (right).
Fig.1: MEMS microrelays prototypes into LTCC
package. a) Top connection design. b) Bottom
Fig.2: ML and UL antenna with RFID 2nd level
Two examples of LTCC packaging application were
performed. Microrelay prototypes with different
geometrical connections were presented. Two antennas
for RFID application are under development.
 M. R. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-
Laguna, J. J. Santiago-Avilés, “Overview of low temperature
co-fired ceramics tape technology for meso-system technology
(MsST)”, Sensors and Actuators A 89, pp. 222-241, 2001.
 A. Lozano, L. Malatto, L. Fraigi, D. Lupi, “Testing of a
MEMS SOI microrelay”, 5th IEEE Latin-American Test
Workshop LATW 2004, Digest of papers, pp. 123-126, 2004.